China's CXMT plans to mass-produce 12-high HBM next year after starting HBM3 8-high mass production this year, according to industry sources cited ET News

China's CXMT's push into high-bandwidth memory (HBM) production signals an aggressive strategy to compete with industry leaders like Samsung and Micron.

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China's CXMT plans to mass-produce 12-high HBM next year after starting HBM3 8-high mass production this year, according to industry sources cited ET News

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  • The move suggests China is closing the gap with SK Hynix (HXSCL), Samsung Electronics (005930 KS) and Micron (MU) in mainstream HBM.
  • CXMT is reportedly converting about 20% of DRAM output to HBM and plans a USD 4.2bln IPO to expand DRAM and HBM lines.
Context

Their planned IPO and shift of significant DRAM capacity to HBM could reshape market dynamics and heighten competition in the semiconductor sector, potentially affecting pricing and supply chains across tech and related industries.

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