Micron (MU) says it expects 512GB RDIMM to enter mass production in H2 2027

Product roadmap disclosures of this kind from memory makers tend to be read less for the specific SKU than for what they imply about the cadence of the server DRAM cycle, since high-capacity RDIMM qualification has historically been the gateway to the next content-per-server uplift and to tighter supply in the preceding quarters. A mass-production date set well out on the horizon is standard practice in this industry: leading-edge modules require lengthy customer qualification with server platform launches, and the sequence has typically run from sampling, through qualification, to volume ramp over several years. The actors here are a concentrated peer set, and the comparative read is usually who reaches volume first, since early qualification on a new capacity tier has tended to confer pricing power during the initial ramp. Worth noting is the distinction between entering mass production and generating material revenue: historically the revenue contribution lags the production milestone by several quarters. Follow-ons that matter are customer qualification commentary, platform timing from the server CPU side, and any shift in the peer set's own roadmap language, which in past cycles has been the tell for whether a tier launches into tight or oversupplied conditions.