PRE-MARKET TAIWAN & SINGAPORE STOCK NEWS: Tech stocks rally across Asia and Nasdaq futures extend on gains following mega-cap earnings

TSMC (2330 TT) - Co, was reportedly developing AI chip packaging technology to compete with Intel (INTC), according to The Information. The report said the effort remained at an early stage and it was unclear when commercial production would begin. TSMC was also reportedly developing technology internally referred to as "EMIB-like" to compete with Intel's Embedded Multi-die Interconnect Bridge. (The Information)

Apple (AAPL) Suppliers - Apple Inc. (AAPL) Q3 2026 (USD): EPS 2.02 (exp. 1.89), Revenue 109.4bln (exp. 108.85bln), Revenue breakdown: iPhone 54.25bln (exp. 53.6bln), Mac 10.35bln (exp. 8.62bln), Greater China 18.816bln (exp. 19.58bln), Wearables 7.883bln (exp. 7.87bln), Services 30.739bln (exp. 31.36bln), Products 78.68bln (exp. 77.25bln), Americas 45.78bln (exp. 45.24bln).

Singapore Telecommunications (ST SP) - Co. Optus unit faces record fines of up to AUD 502mln over a fatal network outage. (The Australian)