Thales (HO FP), Foxconn (2317 TT) and Radiall lay foundation for Tessali semiconductor packaging JV in France; expected to begin production at the end of 2029
#FRANCE#EUROPE#THALES SA#HO.FP#HON HAI PRECISION INDUSTRY CO LTD#2317.TT#EQUITIES#EU SESSION#US SESSION#BUILDING PRODUCTS#BUILDING PRODUCTS (GROUP)#CAPITAL GOODS#S&P 500 INDEX#CAC 40 INDEX#TRANE TECHNOLOGIES PLC#TT#HO#GLOBAL EQUITIES